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Semiconductor Research Corporation
2023 Call for Research
Research Thrust | Call Opens | Papers Due | Program Manager | Program Coordinator |
Artificial Intelligence Hardware | Apr 3 | May 1 | John Oakley | LaDonya Dooley |
Analog/Mixed-Signal Circuits, Systems, and Devices | Apr 10 | May 12 | Marcus Pan | LaDonya Dooley |
Nanomanufacturing Materials and Processes | Apr 10 | May 9 | Kashyap Yellai | Dilcia Paguada |
Logic and Memory Devices | May 1 | May 31 | Kashyap Yellai | Dilcia Paguada |
Environment, Safety, and Health | May 10 | Jun 7 | Kashyap Yellai | Dilcia Paguada |
The selected 3-year projects and their corresponding research results will align directly with the 2030 Decadal Plan for Semiconductors, industry guidance developed by SRC and Semiconductor Industry Association (SIA) that outlines the technology needed by the year 2030. Along with creating critical, industry-relevant technology, these calls will fund graduate degrees for between 50 to 100 student scholars of diverse ethnicity, gender, and geography.
SRC's call for research is tightly aligned with the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap, an industry-wide effort sponsored by the National Institute of Standards and Technology (NIST). The Interim Report of the MAPT Roadmap, available at https://srcmapt.org, was recently published to assist with the planning and execution of CHIPS Act initiatives. U.S. Secretary of Commerce, Gina Raimondo, has emphasized the importance of a "bold domestic investment agenda in strategic and critical sectors" for economic competitiveness and national security. SRC members include global leaders in the semiconductor industry who are committed to investing in revolutionary research, a more diverse and inclusive community, and a long-term, worldwide outlook for sustainability.
The following programs will not have solicitations this year
Research Thrust | Program Manger | Program Coordinator |
Computer Aided Test and Design | Marcus Pan | LaTanya Holmes |
Hardware Security | John Oakley | LaDonya Dooley |
Packaging | John Oakley | LaDonya Dooley |
Packaging CHIRP | John Oakley | LaDonya Dooley |
India Research Program | Marcus Pan | LaTanya Holmes |
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